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MCP73811/2
Simple, Miniature Single-Cell, Fully Integrated Li-Ion / Li-Polymer Charge Management Controllers
Features
* Complete Linear Charge Management Controller - Integrated Pass Transistor - Integrated Current Sense - Integrated Reverse Discharge Protection * Constant Current / Constant Voltage Operation with Thermal Regulation * High Accuracy Preset Voltage Regulation: + 1% * Voltage Regulation: 4.20V * Selectable Charge Current: - MCP73811: 85 mA / 450 mA * Programmable Charge Current: - MCP73812: 50 mA - 500 mA * Minimum External Components Required: - MCP73811: 2 Ceramic Capacitors - MCP73812: 2 Ceramic Capacitors and 1 Resistor * No Preconditioning * No End-of-Charge Control * No Undervoltage Lockout (UVLO) * Automatic Power-Down when Input Power Removed * Active High Charge Enable * Temperature Range: - -40C to +85C * Packaging: - 5-Lead SOT-23
Description
The MCP73811/2 devices are linear charge management controllers that are designed for use in space limited and cost sensitive applications. The MCP73811/2 provide specific charge algorithms for single cell Li-Ion or Li-Polymer battery to achieve optimal capacity in the shortest charging time possible. Along with its small physical size, the low number of external components required make the MCP73811/2 ideally suited for portable applications. For applications charging from a USB port, the MCP73811 adheres to all the specifications governing the USB power bus. The MCP73811/2 employ a constant current/constant voltage charge algorithm. The constant voltage regulation is fixed at 4.20V, with a tight regulation tolerance of 1%. For the MCP73811, the constant current value is selected as 85 mA (low power USB port) or 450 mA (high power USB port) with a digital input signal on the PROG input. For the MCP73812, the constant current value is set with one external resistor. The MCP73811/2 limit the charge current based on die temperature during high power or high ambient conditions. This thermal regulation optimizes the charge cycle time while maintaining device reliability. The MCP73811/2 are fully specified over the ambient temperature range of -40C to +85C. The MCP73811/2 are available in a 5-Lead, SOT-23 package.
Package Types
5-Pin SOT-23
Applications
* Low-Cost Lithium-Ion/Lithium-Polymer Battery Chargers * Rechargeable Toys * Electronic Cigarettes * Bluetooth Headsets * USB Chargers CE VSS VBAT 1 2 3
5
PROG
4
VDD
(c) 2007 Microchip Technology Inc.
DS22036A-page 1
MCP73811/2
Typical Applications
450 mA Li-Ion Battery Charger VIN 1 F 4 VDD VBAT 3 1 F + Single Li-Ion - Cell VIN 1 F 500 mA Li-Ion Battery Charger 4V DD VBAT 3 1 F PROG VSS 2 1 CE 5 2 k + Single Li-Ion - Cell
5
PROG
1
CE
VSS 2
MCP73811
MCP73812
Functional Block Diagram
Direction Control VDD VBAT
6A G=0.001
MCP73812
MCP73811 + 2.7 k CA
PROG 12 k 388.7 k VA
+ Reference Generator VREF (1.21V) 111 k Direction Control + VBAT Charge Enable + 528.6 k 157.3 k
CE VSS
DS22036A-page 2
(c) 2007 Microchip Technology Inc.
MCP73811/2
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
VDDN ................................................................................7.0V All Inputs and Outputs w.r.t. VSS ............... -0.3 to (VDD+0.3)V Maximum Junction Temperature, TJ ............ Internally Limited Storage temperature .....................................-65C to +150C ESD protection on all pins Human Body Model (1.5 kW in Series with 100 pF) ...... 4 kV Machine Model (200pF, No Series Resistance) ..............400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typ.) + 0.3V] to 6V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Supply Input Supply Voltage Supply Current VDD ISS 3.75 -- -- -- Voltage Regulation (Constant Voltage Mode) Regulated Output Voltage Output Voltage Tolerance Line Regulation Load Regulation Supply Ripple Attenuation VREG VRTOL |(VBAT/VBAT) /VDD| |VBAT/VBAT| PSRR -- -1 -- -- -- -- -- Current Regulation (Fast Charge Constant-Current Mode) Fast Charge Current Regulation IREG -- -- -- -- -- Charge Current Tolerance Pass Transistor ON-Resistance ON-Resistance Battery Discharge Current Output Reverse Leakage Current IDISCHARGE -- 0.5 2 A Shutdown (VDD < VBAT - 100 mV) RDSON -- 400 -- m VDD = 3.75V, TJ = 105C IRTOL -10 85 450 50 100 500 -- -- -- -- -- -- +10 mA mA mA mA mA % MCP73811 - PROG = Low MCP73811 - PROG = High MCP73812 - PROG = 20 k MCP73812 - PROG = 10 k MCP73812 - PROG = 2 k TA=-5C to +55C 4.20 -- 0.09 0.09 52 47 22 -- +1 0.30 0.30 -- -- -- V % %/V % dB dB dB VDD=[VREG(Typ)+1V] IOUT=10 mA TA=-5C to +55C VDD=[VREG(Typ)+1V] to 6V IOUT=10 mA IOUT=10 mA to 50 mA VDD=[VREG(Typ)+1V] IOUT=10 mA, 10 Hz to 1 kHz IOUT=10 mA, 10 Hz to 10 kHz IOUT=10 mA, 10 Hz to 1 MHz -- 1000 50 1.2 6 1500 100 5 V A A A Charging Standby (CE = VSS) Shutdown (VDD < VBAT - 100 mV) Sym Min Typ Max Units Conditions
(c) 2007 Microchip Technology Inc.
DS22036A-page 3
MCP73811/2
DC CHARACTERISTICS (Continued)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typ.) + 0.3V] to 6V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Input High Voltage Level Input Low Voltage Level Input Leakage Current PROG Input - MCP73812 Charge Impedance Range Automatic Power Down Entry Threshold Automatic Power Down Exit Threshold Thermal Shutdown Die Temperature Die Temperature Hysteresis TSD TSDHYS -- -- 150 10 -- -- C C RPROG VPD VPDEXIT 2 VBAT + 10 mV -- -- VBAT + 50 mV VBAT + 150 mV 20 -- VBAT + 250 mV k V V MCP73812 2.3V < VBAT < VREG VDD Falling 2.3V < VBAT < VREG VDD Rising Automatic Power Down (Direction Control) Sym VIH VIL ILK Min 2 -- -- Typ -- -- 0.01 Max -- 0.8 1 Units V V A VCE = VDD, VPROG = VDD Conditions Charge Enable (CE), PROG Input - MCP73811
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 6V. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5-Lead, SOT-23 JA -- 230 -- C/W 4-Layer JC51-7 Standard Board, Natural Convection TA TJ TA -40 -40 -65 -- -- -- +85 +125 +150 C C C Sym Min Typ Max Units Conditions
DS22036A-page 4
(c) 2007 Microchip Technology Inc.
MCP73811/2
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode.
4.210 4.200 4.195 4.190 4.185 4.180 4.175 4.170 4.50 4.75 5.00 5.25 5.50 5.75 6.00
IOUT = 450 mA IOUT = 100 mA IOUT = 10 mA
Charge Current (mA)
4.205
90 89 88 87 86 85 84 83 82 81 80 4.5 4.75 5 5.25 5.5 Supply Voltage (V)
Battery Regulation Voltage (V)
PROG = Low Temp = +25C
5.75
6
Supply Voltage (V)
FIGURE 2-1: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD).
Battery Regulation Voltage (V)
FIGURE 2-4: Charge Current (IOUT) vs. Supply Voltage (VDD) - MCP73811.
460
PROG = High Temp = 25C
4.210 4.200 4.195 4.190 4.185 4.180 4.175 4.170 0 10 20 30 40 50 60 70 -40 -30 -20 -10 80
IOUT = 450 mA IOUT = 100 mA IOUT = 10 mA
Charge Current (mA)
4.205
455 450 445 440 435 430 425 4.5 4.75 5 5.25 5.5
5.75
6
Ambient Temperature (C)
Supply Voltage (V)
FIGURE 2-2: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA).
FIGURE 2-5: Charge Current (IOUT) vs. Supply Voltage (VDD) - MCP73811.
100
Output Leakage Current (A)
0.40 0.35 +85C 0.30 -40C 0.25 0.20 +25C 0.15 0.10 0.05 0.00 3.00 3.20
Charge Current (mA)
95 90 85 80 75 70 65
PROG = Low VDD = 5V
3.40
3.60
3.80
4.00
4.20
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Ambient Temperature (C)
Battery Regulation Voltage (V)
FIGURE 2-3: Output Leakage Current (IDISCHARGE) vs. Battery Regulation Voltage (VBAT).
FIGURE 2-6: Charge Current (IOUT) vs. Ambient Temperature (TA) - MCP73811.
(c) 2007 Microchip Technology Inc.
DS22036A-page 5
MCP73811/2
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode.
480 Charge Current (mA) 470 460 450 440 430 420 410 400 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Ambient Temperature (C)
516
Charge Current (mA)
PROG = High VDD = 5V
514 512 510 508 506 504 502 500 4.50 4.75 5.00 5.25 5.50
RPROG = 2 k
5.75
6.00
Supply Voltage (V)
FIGURE 2-7: Charge Current (IOUT) vs. Ambient Temperature (TA) - MCP73811.
550 500 450 400 350 300 250 200 150 100 50 0 2 4 6 8 10 12 14 16 18 20
FIGURE 2-10: Charge Current (IOUT) vs. Supply Voltage (VDD) - MCP73812.
104
Charge Current (mA)
Charge Current (mA)
103 102 101 100 99 98 97 96 -40 -30 -20 -10 0 10 20 30 40
RPROG = 10 k
50
60 60
70 70
Programming Resistor (k)
Ambient Temperature (C)
FIGURE 2-8: Charge Current (IOUT) vs. Programming Resistor (RPROG) - MCP73812.
104
Charge Current (mA)
RPROG = 10 k
FIGURE 2-11: Charge Current (IOUT) vs. Ambient Temperature (TA) - MCP73812.
516
Charge Current (mA)
103 102 101 100 99 98 97 96 4.50 4.75 5.00 5.25 5.50
514 512 510 508 506 504 502 500 0 10 20 30 40 50 -40 -30 -20 -10
RPROG = 2 k
5.75
6.00
Supply Voltage (V)
Ambient Temperature (C)
FIGURE 2-9: Charge Current (IOUT) vs. Supply Voltage (VDD) - MCP73812.
FIGURE 2-12: Charge Current (IOUT) vs. Ambient Temperature (TA) - MCP73812.
DS22036A-page 6
(c) 2007 Microchip Technology Inc.
80
80
MCP73811/2
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode.
120
Charge Current (mA)
105 90 75 60 45 30 15 0 25 35 45 55 65 75 85 95 105 115
RPROG = 10 k
0 -10 Attenuation (dB) -20 -30 -40 -50
VAC = 100 mVp-p IOUT = 100 mA COUT = 4.7 F, X7R Ceramic
-60 0.01
125
135
145
155
0.1
1
10
100
1000
Junction Temperature (C)
Frequency (kHz)
FIGURE 2-13: Charge Current (IOUT) vs. Junction Temperature (TJ) - MCP73812.
525
Charge Current (mA)
FIGURE 2-16: Power Supply Ripple Rejection (PSRR).
14 12
Source Voltage (V)
450 375 300 225 150 75 0 25 35 45 55 65 75 85 95 105 115
RPROG = 2 k
0.10 0.05 0.00 -0.05 -0.10 -0.15
IOUT = 10 mA COUT = 4.7 F, X7R Ceramic
10 8 6 4 2 0 -2 0 20 40 60 80 100
-0.20 -0.25 -0.30 200
125
135
145
155
120
140
160
Junction Temperature (C)
Time (s)
FIGURE 2-14: Charge Current (IOUT) vs. Junction Temperature (TJ) - MCP73812.
0 -10
FIGURE 2-17:
Line Transient Response.
14
Source Voltage (V)
VAC = 100 mVp-p IOUT = 10 mA COUT = 4.7 F, X7R Ceramic
180
0.10 0.05 -0.05 -0.10 -0.15
IOUT = 100 mA COUT = 4.7 F, X7R Ceramic
12 10 8 6 4 2 0 -2 0 20 40 60 80 100
Attenuation (dB)
-20 -30 -40 -50
-0.20 -0.25 -0.30 200
-60 0.01
120
140
160
0.1
1
10
100
1000
Frequency (kHz)
Time (s)
FIGURE 2-15: Power Supply Ripple Rejection (PSRR).
FIGURE 2-18:
Line Transient Response.
(c) 2007 Microchip Technology Inc.
DS22036A-page 7
180
Output Ripple (V)
0.00
Output Ripple (V)
MCP73811/2
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode.
0.35 0.30
Output Current (A)
0.04 0.02 0.00 -0.02 -0.04 -0.06
COUT = 4.7 F, X7R Ceramic
6.0
Battery Voltage (V) Output Ripple (V)
120
Charge Current (mA) Charge Current (mA)
5.0 4.0 3.0 2.0 1.0 0.0 0 20 40 60 80 100 120 140 160 180
MCP73812/IOT VDD = 5.2V RPROG = 10 k
100 80 60 40 20 0
0.25 0.20 0.15 0.10 0.05 0.00 -0.05 0 20 40 60 80 100 120 140 160 180 200
-0.08 -0.10 -0.12
Time (s)
Time (s)
FIGURE 2-19:
Load Transient Response.
FIGURE 2-21: Complete Charge Cycle (180 mAh Li-Ion Battery).
6.0
Battery Voltage (V)
1.40 1.20
Output Current (A)
0.10 0.05
Output Ripple (V)
600 500 400 300 200
MCP738312 VDD = 5.2V RPROG = 2 k
1.00 0.80 0.60 0.40 0.20 0.00 -0.20 0 20 40 60 80 100 120 140 160 180 200
COUT = 4.7 F, X7R Ceramic
0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -0.30
5.0 4.0 3.0 2.0 1.0 0.0 0 30 60 90 120 150 180 210 240
100 0
Time (s)
Time (s)
FIGURE 2-20:
Load Transient Response.
FIGURE 2-22: Complete Charge Cycle (1000 mAh Li-Ion Battery).
DS22036A-page 8
(c) 2007 Microchip Technology Inc.
MCP73811/2
3.0 PIN DESCRIPTION
PIN FUNCTION TABLES
Symbol CE VSS VBAT VDD PROG Active High Charge Enable Battery Management 0V Reference Battery Charge Control Output Battery Management Input Supply Current Regulation Set and Charge Control Enable Function The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin Number SOT-23-5 1 2 3 4 5
3.1
Charge Enable Input (CE)
3.4
A logic High enables battery charging. A logic Low disables battery charging. The charge enable input is compatible with 1.8V logic.
Battery Management Input Supply (VDD)
A supply voltage of [VREG (typ.) + 0.3V] to 6V is recommended. Bypass to VSS with a minimum of 1 F.
3.2
Battery Management 0V Reference (VSS)
3.5
Current Regulation Set (PROG)
Connect to negative terminal of battery and input supply.
For the MCP73811, the current regulation set input (PROG) functions as a digital input selection. A logic Low selects a 85 mA charge current; a logic High selects a 450 mA charge current. For the MCP73812, the charge current is set by placing a resistor from PROG to VSS.
3.3
Battery Charge Control Output (VBAT)
Connect to positive terminal of battery. Drain terminal of internal P-channel MOSFET pass transistor. Bypass to VSS with a minimum of 1 F to ensure loop stability when the battery is disconnected.
(c) 2007 Microchip Technology Inc.
DS22036A-page 9
MCP73811/2
4.0 DEVICE OVERVIEW
4.3 PRECONDITIONING
The MCP73811/2 are simple, but fully integrated linear charge management controllers. Figure 4-1 depicts the operational flow algorithm. The MCP73811/2 does not support preconditioning of deeply depleted cells.
4.4
SHUTDOWN MODE* VDD < VPD
Constant Current MODE - Fast Charge
During the constant current mode, the selected (MCP73811) or programmed (MCP73812) charge current is supplied to the battery or load. For the MCP73812, the charge current is established using a single resistor from PROG to VSS. The program resistor and the charge current are calculated using the following equation:
STANDBY MODE* CE = Low
EQUATION 4-1:
CONSTANT CURRENT MODE Charge Current = IREG VBAT < VREG VBAT = VREG
1000V I REG = ---------------R PROG Where: RPROG IREG = = kilo-ohms milliamperes
CONSTANT VOLTAGE MODE Charge Voltage = VREG
Constant current mode is maintained until the voltage at the VBAT pin reaches the regulation voltage, VREG.
* Continuously Monitored
4.5
Constant Voltage Mode
FIGURE 4-1:
Flow Chart.
4.1
Undervoltage Lockout (UVLO)
When the voltage at the VBAT pin reaches the regulation voltage, VREG, constant voltage regulation begins. The regulation voltage is factory set to 4.20V with a tolerance of 1.0%.
The MCP73811/2 does not have an internal under voltage lockout (UVLO) circuit.
4.6
Charge Termination
4.2
Charge Qualification
When the input power is applied, the input supply must rise 150 mV above the battery voltage before the MCP73811/2 becomes operational. The automatic power down circuit places the device in a shutdown mode if the input supply falls to within +50 mV of the battery voltage. The automatic circuit is always active. Whenever the input supply is within +50 mV of the voltage at the VBAT pin, the MCP73811/2 is placed in a shutdown mode. During power down condition, the battery reverse discharge current is less than 2 A. For a charge cycle to begin, the automatic power down conditions must be met and the charge enable input must be above the input high threshold.
The charge cycle is terminated by removing the battery from the charger, removing input power, or driving the charge enable input (CE) to a logic Low. An automatic charge termination method is not implemented.
4.7
Automatic Recharge
The MCP73811/2 does not support automatic recharge cycles since automatic charge termination has not been implemented. In essence, the MCP73811/2 is always in a charge cycle whenever the qualification parameters have been met.
DS22036A-page 10
(c) 2007 Microchip Technology Inc.
MCP73811/2
4.8 Thermal Regulation 4.9 Thermal Shutdown
The MCP73811/2 limits the charge current based on the die temperature. The thermal regulation optimizes the charge cycle time while maintaining device reliability. Figure 4-2 depicts the thermal regulation for the MCP73811/2.
.
The MCP73811/2 suspends charge if the die temperature exceeds 150C. Charging will resume when the die temperature has cooled by approximately 10C. The thermal shutdown is a secondary safety feature in the event that there is a failure within the thermal regulation circuitry.
525
Charge Current (mA)
450 375 300 225 150 75 0 25 35 45 55 65 75 85 95 105 115
RPROG = 2 k
125
135
145
Junction Temperature (C)
FIGURE 4-2:
Thermal Regulation.
(c) 2007 Microchip Technology Inc.
155
DS22036A-page 11
MCP73811/2
5.0
5.1
5.1.1
DETAILED DESCRIPTION
Analog Circuitry
BATTERY MANAGEMENT INPUT SUPPLY (VDD)
5.2
5.2.1
Digital Circuitry
CHARGE ENABLE (CE)
The VDD input is the input supply to the MCP73811/2. The MCP73811/2 automatically enters a Power-down mode if the voltage on the VDD input falls to within +50 mV of the battery voltage. This feature prevents draining the battery pack when the VDD supply is not present.
The charge enable input pin (CE) can be used to terminate a charge at any time during the charge cycle, as well as to initiate a charge cycle or initiate a recharge cycle. Driving the input to a logic High enables the device. Driving the input to a logic Low disables the device and terminates a charge cycle. When disabled, the device's supply current is reduced to 50 A, typically.
5.2.2
5.1.2
MCP73812 CURRENT REGULATION SET (PROG)
MCP73811 CURRENT REGULATION SELECT (PROG)
For the MCP73812, the charge current regulation can be scaled by placing a programming resistor (RPROG) from the PROG input to VSS. The program resistor and the charge current are calculated using the following equation:
For the MCP73811, driving the PROG input to a logic Low selects the low charge current setting (85 mA). Driving the PROG input to a logic High selects the high charge current setting (450 mA).
EQUATION 5-1:
1000V I REG = ---------------R PROG Where: RPROG IREG = = kilo-ohms milliamperes
5.1.3
BATTERY CHARGE CONTROL OUTPUT (VBAT)
The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP73811/2 provides constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack.
DS22036A-page 12
(c) 2007 Microchip Technology Inc.
MCP73811/2
6.0 APPLICATIONS
The MCP73811/2 is designed to operate in conjunction with a host microcontroller or in stand-alone applications. The MCP73811/2 provides the preferred charge algorithm for Lithium-Ion and Lithium-Polymer cells Constant-current followed by Constant-voltage. Figure 6-1 depicts a typical stand-alone application circuit, while Figures 6-2 and 6-3 depict the accompanying charge profile.
Li-Ion Battery Charger 4V DD VBAT 3 COUT 5 RPROG + Single Li-Ion - Cell
CIN
PROG REGULATED WALL CUBE 1 CE VSS
2
MCP73812
FIGURE 6-1:
6.0
Battery Voltage (V)
Typical Application Circuit.
6.1
120
Charge Current (mA)
Application Circuit Design
5.0 4.0 3.0 2.0 1.0 0.0 0 20 40 60 80 100 120 140 160 180
MCP73812/IOT VDD = 5.2V RPROG = 10 k
100 80 60 40 20 0
Time (s)
Due to the low efficiency of linear charging, the most important factors are thermal design and cost, which are a direct function of the input voltage, output current and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is when the device has transitioned from the Preconditioning mode to the Constant-current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost and thermal requirements of the charger.
FIGURE 6-2: Typical Charge Profile (180 mAh Battery).
6.0
Battery Voltage (V)
6.1.1
COMPONENT SELECTION
600
Charge Current (mA)
Selection of the external components in Figure 6-1 is crucial to the integrity and reliability of the charging system. The following discussion is intended as a guide for the component selection process.
5.0 4.0 3.0 2.0 1.0 0.0 0 30 60 90 120 150 180 210 240
MCP738312 VDD = 5.2V RPROG = 2 k
500 400 300 200 100 0
6.1.1.1
Charge Current
The preferred fast charge current for Lithium-Ion cells is at the 1C rate, with an absolute maximum current at the 2C rate. For example, a 500 mAh battery pack has a preferred fast charge current of 500 mA. Charging at this rate provides the shortest charge cycle times without degradation to the battery pack performance or life.
Time (s)
FIGURE 6-3: Typical Charge Profile in Thermal Regulation (1000 mAh Battery).
(c) 2007 Microchip Technology Inc.
DS22036A-page 13
MCP73811/2
6.1.1.2 Thermal Considerations 6.1.1.5 Charge Inhibit
The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum and the device has transitioned from the Preconditioning mode to the Constant-current mode. In this case, the power dissipation is: The charge enable input pin (CE) can be used to terminate a charge at any time during the charge cycle, as well as to initiate a charge cycle or initiate a recharge cycle. Driving the input to a logic High enables the device. Driving the input to a logic Low disables the device and terminates a charge cycle. When disabled, the device's supply current is reduced to 50 A, typically.
EQUATION 6-1:
PowerDissipation = ( V DDMAX -V PTHMIN )xI REGMAX
Where: VDDMAX IREGMAX VPTHMIN = = = the maximum input voltage the maximum fast charge current the minimum transition threshold voltage
6.2
PCB Layout Issues
For optimum voltage regulation, place the battery pack as close as possible to the device's VBAT and VSS pins, recommended to minimize voltage drops along the high current-carrying PCB traces. If the PCB layout is used as a heatsink, adding many vias in the heatsink pad can help conduct more heat to the backplane of the PCB, thus reducing the maximum junction temperature. Figures 6-4 and 6-5 depict a typical layout with PCB heatsinking.
RPROG VSS
Power dissipation with a 5V, 10% input voltage source is:
EQUATION 6-2:
PowerDissipation = ( 5.5V - 2.7V ) x 500mA = 1.4W
This power dissipation with the battery charger in the SOT-23-5 package will cause thermal regulation to be entered as depicted in Figure 6-3.
VBAT
COUT MCP73812
CIN
VDD
6.1.1.3
External Capacitors FIGURE 6-4: Typical Layout (Top).
The MCP73811/2 is stable with or without a battery load. In order to maintain good AC stability in the Constant-voltage mode, a minimum capacitance of 1 F is recommended to bypass the VBAT pin to VSS. This capacitance provides compensation when there is no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant-voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the inductive nature of the battery pack. Virtually any good quality output filter capacitor can be used, independent of the capacitor's minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 1 F ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability for output currents up to a 500 mA.
VSS
VBAT
VDD
FIGURE 6-5:
Typical Layout (Bottom).
6.1.1.4
Reverse-Blocking Protection
The MCP73811/2 provides protection from a faulted or shorted input. Without the protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor.
DS22036A-page 14
(c) 2007 Microchip Technology Inc.
MCP73811/2
7.0
7.1
PACKAGE INFORMATION
Package Marking Information
5-Pin SOT-23 Example:
XXNN
1
Standard * Part Number MCP73811T-420I/OT MCP73812T-420I/OT Code KSNN KWNN 1
KSNN
* Custom output voltages available upon request. Contact your local Microchip sales office for more information.
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2007 Microchip Technology Inc.
DS22036A-page 15
MCP73811/2
5-Lead Plastic Small Outline Transistor (OT or CT) [SOT-23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
b
N
E E1
1 e
2
3
e1 D
A
A2
c
A1
L L1
Units Dimension Limits Number of Pins Lead Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness N e e1 A A2 A1 E E1 D L L1 c 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0 0.08 MIN MILLIMETERS NOM 5 0.95 BSC 1.90 BSC - - - - - - - - - - 1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 30 0.26 MAX
Lead Width b 0.20 - 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-091B
DS22036A-page 16
(c) 2007 Microchip Technology Inc.
MCP73811/2
APPENDIX A: REVISION HISTORY
Revision A (March 2007)
* Original Release of this Document.
(c) 2007 Microchip Technology Inc.
DS22036A-page 17
MCP73811/2
NOTES:
DS22036A-page 18
(c) 2007 Microchip Technology Inc.
MCP73811/2
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device
-- XXX
X
/XX
Examples:
a) MCP73811T-420I/OT: 4.2V Charger SOT-23-5 pkg. 4.2V Charger SOT-23-5 pkg.
Voltage Temperature Package Options
a)
Device: MCP73811T: Li-Ion Charger w/Selectable Charge Current, Tape and Reel MCP73812T: Li-Ion Charger w/Selectable Charge Current, Tape and Reel 420 = 4.2V "Standard" *Contact factory for other output voltage options. Temperature: Package Type: I = -40C to +85C
MCP73812T-420I/OT:
Voltage Options *:
OT = Small Outline Transistor (SOT-23), 5-lead
(c) 2007 Microchip Technology Inc.
DS22036A-page 19
MCP73811/2
NOTES:
DS22036A-page 20
(c) 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2007 Microchip Technology Inc.
DS22036A-page 21
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256
ASIA/PACIFIC
India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
12/08/06
DS22036A-page 22
(c) 2007 Microchip Technology Inc.

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